Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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{| border="2" cellspacing="0" cellpadding="9" | {| border="2" cellspacing="0" cellpadding="9" | ||
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Recipe name | !colspan="1" border="none" style="background:silver; color:black;" align="center"|Recipe name | ||
|style="background:silver; color:black"|<b>Target material | |style="background:silver; color:black"|<b>Target material</b> | ||
|style="background:silver; color:black"|<b>Pressure (mTorr)</b> | |style="background:silver; color:black"|<b>Pressure (mTorr)</b> | ||
|style="background:silver; color:black"|<b>Power (W)</b> | |style="background:silver; color:black"|<b>Power (W)</b> | ||