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[[Category: Equipment|Thin film Sputter deposition Lesker]]
[[Category: Equipment|Thin film Sputter deposition Lesker]]
[[Category: Thin Film Deposition|Sputter deposition Lesker]]
[[Category: Thin Film Deposition|Sputter deposition Lesker]]
[[image:Kaempe_Lesker_image_front_page1.jpg|450x450px|right|thumb|Cluster-based multi-chamber high vacuum sputtering deposition system. View from service room Ax-1.]]


Cluster-based multi-chamber high vacuum sputtering deposition system is a robotic cluster tool with two deposition chambers sharing the same distribution trasfer station and the load-lock. The equipment has been installed and accepted in clean-room during January 2020. The purpose of the tool is to deposite variety of materials using DC/RF/PulseDC/HIPIMS magnetron sputtering with or without RF substrate bias. In modul A or <b>PC 1</b> (process chamber 1) it is possible to deposit any materials using 6 x 3” magnetrons sourses with N<sub>2</sub> or O<sub>2</sub> reactive gases. Modul B or <b>PC 3</b>  (process chamber 3) is dedicated to oxygen free materials - nitrides and metals. It is eqipted with 1 x 4” + 2 x 3” magnetrons and supplied with N<sub>2</sub> process gas for reactive deposition. Both chambers allow heating of substrates up to 600 <sup>o</sup>C. The equipment is located in clean-room A-5 where the user can acces the cassete loader.  
Cluster-based multi-chamber high vacuum sputtering deposition system is a robotic cluster tool with two deposition chambers sharing the same distribution trasfer station and the load-lock. The equipment has been installed and accepted in clean-room during January 2020. The purpose of the tool is to deposite variety of materials using DC/RF/PulseDC/HIPIMS magnetron sputtering with or without RF substrate bias. In modul A or <b>PC 1</b> (process chamber 1) it is possible to deposit any materials using 6 x 3” magnetrons sourses with N<sub>2</sub> or O<sub>2</sub> reactive gases. Modul B or <b>PC 3</b>  (process chamber 3) is dedicated to oxygen free materials - nitrides and metals. It is eqipted with 1 x 4” + 2 x 3” magnetrons and supplied with N<sub>2</sub> process gas for reactive deposition. Both chambers allow heating of substrates up to 600 <sup>o</sup>C. The equipment is located in clean-room A-5 where the user can acces the cassete loader.  


[[image:Kaempe_Lesker_image_front_page1.jpg|450x450px|right|thumb|Cluster-based multi-chamber high vacuum sputtering deposition system. View from service room Ax-1.]]
 


<b> Manufacture:</b> Kurt J. Lesker Company
<b> Manufacture:</b> Kurt J. Lesker Company
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