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= Sputter-System Metal-Oxide(PC1) =
Thin Film group thinfilm@nanolab.dtu.dk is responsible of the equipment


The purpose of the sputter is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time.
Target/Metal requests should be sent to metal@nanolab.dtu.dk


It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the Thin Film group so they can help you.
If you need a training on the machine please send your request to: training@nanolab.dtu.dk.


Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter.


= Sputter-System Metal-Oxide(PC3) =
= Sputter-System Metal-Oxide(PC3) =
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