Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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[[Category: Thin Film Deposition|Sputter deposition Lesker]] | [[Category: Thin Film Deposition|Sputter deposition Lesker]] | ||
Cluster-based multi-chamber high vacuum sputtering deposition system is a robotic cluster tool with two deposition chambers sharing the same distribution trasfer station and the load-lock. The equipment has been installed and accepted in clean-room during January 2020. The purpose is to deposite variety of materials using DC/RF/PulseDC/HIPIMS magnetron sputtering with or without RF substrate bias. Both | Cluster-based multi-chamber high vacuum sputtering deposition system is a robotic cluster tool with two deposition chambers sharing the same distribution trasfer station and the load-lock. The equipment has been installed and accepted in clean-room during January 2020. The purpose is to deposite variety of materials using DC/RF/PulseDC/HIPIMS magnetron sputtering with or without RF substrate bias. Both chambers allow heating of substrates up to 600 C | ||
[[image:Kaempe_Lesker_image_front_page1.jpg|450x450px|right|thumb|Cluster-based multi-chamber high vacuum sputtering deposition system. View from service room Ax-1.]] | [[image:Kaempe_Lesker_image_front_page1.jpg|450x450px|right|thumb|Cluster-based multi-chamber high vacuum sputtering deposition system. View from service room Ax-1.]] | ||