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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
No edit summary
Line 12: Line 12:
<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=441  Sputter-System Metal-Oxide(PC1)]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=441  Sputter-System Metal-Oxide(PC1)]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=442  Sputter-System Metal-Nitride(PC3)]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=442  Sputter-System Metal-Nitride(PC3)]


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