Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter. | Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter. | ||
= Sputter-System Metal-Oxide(PC3) = | |||
The purpose of the sputter is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time. | The purpose of the sputter is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time. | ||