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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=244  Sputter-System(Lesker) in LabManager]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=244  Sputter-System(Lesker) in LabManager]


== Sputter-System Metal-Oxide(PC1) ==
= Sputter-System Metal-Oxide(PC1) =


The purpose of the sputter is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time.
The purpose of the sputter is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time.
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