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LabAdviser/Technology Research/Technology Development of 3D Silicon Plasma Etching process for Novel Devices and Applications: Difference between revisions

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DCH-Employees-701, NLAB-LabmanagerAllUsers
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:Microelectronic Engineering (2018) [https://doi.org/10.1016/j.mee.2018.02.023  DOI]
:Microelectronic Engineering (2018) [https://doi.org/10.1016/j.mee.2018.02.023  DOI]
==Conference contributions==
*;'''RIE-lag “Correction” and Infinite Etching Selectivity with Conventional Photoresist in a Bosch Process'''
:<u>Chang, B.</u>, Leussink, P., Jensen, F., Hübner, J. and Jansen, H.
:Poster presentation at 43rd International conference on Micro and Nano Engineering, Braga, Portugal (2017)
*;'''Three dimensional engineering of silicon micro- and nanostructures'''
:<u>Chang, B.</u>, Jensen, F., Hübner, J. and Jansen, H.
:Oral presentation at 44rd International conference on Micro and Nano Engineering, Copenhagen, Denmark (2018)
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