LabAdviser/Technology Research/Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes: Difference between revisions
Appearance
Created page with "=Ice Lithography for Advanced Nanofabrication= *Project type: Ph.D. project *Project responsible: William Tiddi *Sites involved: DTU Danchip, ==Project description== [[image:..." |
|||
| Line 4: | Line 4: | ||
*Sites involved: DTU Danchip, | *Sites involved: DTU Danchip, | ||
==Project | ==Project Description== | ||
[[image:Williams project description.jpg|400px|thumb|Adapted from Han A. et al. (2011) [left] and Han A. et al. (2012) [right]]] | [[image:Williams project description.jpg|400px|thumb|Adapted from Han A. et al. (2011) [left] and Han A. et al. (2012) [right]]] | ||
Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | ||