Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions
Appearance
| Line 86: | Line 86: | ||
|Deposition rate [Å/min] | |Deposition rate [Å/min] | ||
|RI | |RI | ||
|Uniformity [%] | |Uniformity [%]<br \>[Std./mean] | ||
|Stress [MPa] | |Stress [MPa] | ||
|- | |- | ||
| Line 92: | Line 92: | ||
|~117 | |~117 | ||
|~1.99 | |~1.99 | ||
| | |~4 | ||
|~-30 | |~-30 | ||
|- | |- | ||