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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,324 edits
Line 154: Line 154:
|650
|650
|20HF 6s  
|20HF 6s  
20LF 2s
30LF 2s
|Low stress nitride - standard recipe. The latest measured values can be seen in the process control sheet in LabManager.
|Low stress nitride - standard recipe. The latest measured values can be seen in the process control sheet in LabManager.
|-
|-
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