Specific Process Knowledge/Lithography/Coaters

Coaters: Comparison Table

Equipment		SSE Spinner	KS Spinner
Purpose		Spinning and baking of AZ2514E resist Spinning and baking of AZ4562 resist Spinning and baking of e-beam resist	Spinning and baking of AZ2514E resist Spinning and baking of AZ4562 resist Spinning and baking of SU8 resist
Performance	Substrate handling	Cassette-to-cassette Edge handling chuck	Single substrate Non-vacuum chuck for fragile substrates
	Permanent media	AZ5214E resist AZ4562 resist Acetone for chuck cleaning Acetone for drip pan	AZ5214E resist PGMEA for edge bead removal Acetone for chuck cleaning
	Manual dispense option	2 automatic syringes	yes pneumatic dispense for SU8 resist
Process parameter range	Parameter 1	Range	Range
	Parameter 2	Range	Range
Substrates	Batch size	24 50 mm wafers 24 100 mm wafers 24 150 mm wafers	1 100 mm wafers 1 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

SSE Spinner

The SSE spinner MAXIMUS: positioned in Cleanroom 13.

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KS Spinner

The KS spinner is placed in Cleanroom 3.

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Manual Spinner( Polymers)

The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.

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SÜSS Spinner-Stepper

The SÜSS Spinner-Stepper is placed in Stepper room.

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