Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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[[Image:SSEspinner2.jpg|200 × 200px|thumb|The SSE spinner MAXIMUS: positioned in Cleanroom 13.]]
[[Image:SSEspinner2.jpg|200 × 200px|thumb|The SSE spinner MAXIMUS: positioned in Cleanroom 13.]]


== Process information ==


Link to process pages


*[[Specific_Process_Knowledge/Photolithography/AZ5214E_standard_resist_-_positive_process|Positive process with AZ5214E resist]]
*[[Specific_Process_Knowledge/Photolithography/AZ5214E_standard_resist_-_reverse_process|Reverse process with AZ5214E resist]]
*[[Specific_Process_Knowledge/Photolithography/AZ4562_standard_resist_-_positive_process|Positive process with AZ4562 resist]]
*[[Specific_Process_Knowledge/E-beam_lithography|E-beam process with ZEP 520A resist]]


Information about resist can be found here:
* [http://groups.mrl.uiuc.edu/dvh/pdf/AZ5214E.pdf AZ5214E ]
* [http://www.microchemicals.eu/micro/az_4500_series.pdf AZ4562]
* [http://www.zeonchemicals.com/pdfs/ZEP520A.pdf ZEP520A]


==KS Spinner==
==KS Spinner==
[[Image:KSspinner.JPG|200×200px|right|thumb|The KS spinner is placed in Cleanroom 3.]]
[[Image:KSspinner.JPG|200×200px|right|thumb|The KS spinner is placed in Cleanroom 3.]]


== Process information ==
Link to process pages


*[[Specific_Process_Knowledge/Photolithography/AZ5214E_standard_resist_-_positive_process|Positive process with AZ5214E resist]]
*[[Specific_Process_Knowledge/Photolithography/AZ5214E_standard_resist_-_reverse_process|Reverse process with AZ5214E resist]]
*[[Specific_Process_Knowledge/Photolithography/AZ4562_standard_resist_-_positive_process|Positive process with AZ4562 resist]]
*[[Specific_Process_Knowledge/Photolithography/SU8|Process with SU8 resist]]


Information about resist can be found here:


* [http://groups.mrl.uiuc.edu/dvh/pdf/AZ5214E.pdf AZ5214E ]
* [http://www.microchemicals.eu/micro/az_4500_series.pdf AZ4562]
* [http://microchem.com/pdf/SU-82000DataSheet2000_5thru2015Ver4.pdf SU8 2005]
* [http://microchem.com/pdf/SU-82000DataSheet2025thru2075Ver4.pdf SU8 2075]


==Manual Spinner( Polymers)==
==Manual Spinner( Polymers)==
[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]
[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]


The Manual Spinner(Polymers), Opticoat SB20+, from SSE Sister Semiconductor Equipment, are dedicated for spinning of imprint polymers, e-beam resist in small batches, SU8 resist and other polymers with extra addictive like color, nano particles etc.
There are 2 hotplates with temperature range up to 250C, placed in the same fumehood, which can be used for baking before/after spinning.
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]


== Process information ==
Link to process pages


==SÜSS Spinner-Stepper==
==SÜSS Spinner-Stepper==
[[Image:Gamma_2M.jpg|200×200px|right|thumb|The SÜSS Spinner-Stepper is placed in Stepper room.]]
[[Image:Gamma_2M.jpg|200×200px|right|thumb|The SÜSS Spinner-Stepper is placed in Stepper room.]]


This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size. The machine is equipped with the 3 resist lines, a automatic syringe system and a solvent line for cleaning and back-side rinse.
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
Information about resist can be found here:
* Bottom Anti Reflection Coating (BARC)[http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6 ].
*[[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]].
*Positive DUV resist for spinning in 300-600 thickness range [[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]].
== Process information ==


Link to process pages


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==

Revision as of 11:08, 30 May 2013

SSE Spinner

The SSE spinner MAXIMUS: positioned in Cleanroom 13.



KS Spinner

The KS spinner is placed in Cleanroom 3.



Manual Spinner( Polymers)

The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.


SÜSS Spinner-Stepper

The SÜSS Spinner-Stepper is placed in Stepper room.


Equipment performance and process related parameters

Equipment SSE Spinner KS Spinner
Purpose
  • Spinning and baking of AZ2514E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of e-beam resist
  • Spinning and baking of AZ2514E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of SU8 resist
Performance Substrate handling
  • Cassette-to-cassette
  • Edge handling chuck
  • Single substrate
  • Non-vacuum chuck for fragile substrates
Permanent media
  • AZ5214E resist
  • AZ4562 resist
  • Acetone for chuck cleaning
  • Acetone for drip pan
  • AZ5214E resist
  • PGMEA for edge bead removal
  • Acetone for chuck cleaning
Manual dispense option
  • 2 automatic syringes
  • yes
  • pneumatic dispense for SU8 resist
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • 24 50 mm wafers
  • 24 100 mm wafers
  • 24 150 mm wafers
  • 1 100 mm wafers
  • 1 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3