Specific Process Knowledge/Back-end processing/Polymer Injection Molder: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>Value</b>
|style="background:WhiteSmoke; color:black"|<b>Value</b>
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Sample dimensions
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Processing temperatures
|style="background:LightGrey; color:black"|Diameter
|style="background:LightGrey; color:black"|Mold
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
50, 100 or 150 mm (~ 2", 4" or 6")
Up to 160*C


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|style="background:LightGrey; color:black"|Sample thickness
|style="background:LightGrey; color:black"|Barrel
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Maximum 1,0 mm
Absolute max: 350*C


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3,5 - 3,8
3,5 - 3,8
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Seed metal
|style="background:LightGrey; color:black"|Injection speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
Up to 53 cm3/s
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Injection pressure
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|style="background:WhiteSmoke; color:black"|
Most materials allowed. See below.
Up to 2200 bar
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| style="background:LightGrey; color:black"|Forbidden materials
| style="background:LightGrey; color:black"|Switch-over point
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|style="background:WhiteSmoke; color:black"|
Copper, cobalt. See machine manual on LabManager for details
Time, pressure, volumen or external signal
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Revision as of 10:47, 11 June 2013

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Polymer injection molding

The injection molder at Danchip is an Engel Victory Tech 80/45. It is a hydraulic machine capable of up to 450 kN of clamping force.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Injection molding machine in the basement under the cleanroom

Polymer injection molding Info on LabManager

Process information

There are no standard processes on the injection molder, since the type of process chosen and process parameters will depend on which polymer that will be used and what type of pattern that is to be replicated during the molding process.

At Danchip the following polymers are used routinely:

Topas 5013L-10
Topas 8007S-04

Some other polymers are used occasionally, such as Polypropylene and Polystyrene. Other polymers can be used after approval and small batches of other polymers are available. Please ask Danchip for details.

Generally two different types of processes are run at Danchip: Constant temperature processes and variotherm processes. An overview of these two processes are given in the table below.

Equipment performance and process related parameters

Parameter Value
Processing temperatures Mold

Up to 160*C

Barrel

Absolute max: 350*C

Process parameters Temperature

52*C

pH

3,5 - 3,8

Process parameters Injection speed

Up to 53 cm3/s

Injection pressure

Up to 2200 bar

Switch-over point

Time, pressure, volumen or external signal


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