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Specific Process Knowledge/Back-end processing/Polymer Injection Molder: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>Value</b>
|style="background:WhiteSmoke; color:black"|<b>Value</b>
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Sample dimensions
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Processing temperatures
|style="background:LightGrey; color:black"|Diameter
|style="background:LightGrey; color:black"|Mold
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50, 100 or 150 mm (~ 2", 4" or 6")
Up to 160*C


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|style="background:LightGrey; color:black"|Sample thickness
|style="background:LightGrey; color:black"|Barrel
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Maximum 1,0 mm
Absolute max: 350*C


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3,5 - 3,8
3,5 - 3,8
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Sample requirements
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Seed metal
|style="background:LightGrey; color:black"|Injection speed
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100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]].
Up to 53 cm3/s
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Injection pressure
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Most materials allowed. See below.
Up to 2200 bar
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| style="background:LightGrey; color:black"|Forbidden materials
| style="background:LightGrey; color:black"|Switch-over point
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Copper, cobalt. See machine manual on LabManager for details
Time, pressure, volumen or external signal
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