Specific Process Knowledge/Back-end processing/Polymer Injection Molder: Difference between revisions

From LabAdviser
Choi (talk | contribs)
Choi (talk | contribs)
Line 21: Line 21:
At Danchip the following polymers are used routinely:
At Danchip the following polymers are used routinely:


Topas 5013L-10
Topas 5013L-10<br>
Topas 8007S-04
Topas 8007S-04



Revision as of 14:34, 28 May 2013

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Polymer injection molding

The injection molder at Danchip is an Engel Victory Tech 80/45. It is hydraulic machine capable of up to 450 kN of clamping force.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Injection molding machine in the basement under the cleanroom

Polymer injection molding Info on LabManager

Process information

There are no standard processes on the injection molder, since the type of process chosen and process parameters will depend on which polymer that will be used and what type of pattern that is to be replicated during the molding process.

At Danchip the following polymers are used routinely:

Topas 5013L-10
Topas 8007S-04

Some other polymers are used occasionally, such as Polypropylene and Polystyrene. Other polymers can be used after approval and small batches of other polymers are available. Please ask Danchip for details.

Generally two different types of processes are run at Danchip: Constant temperature processes and variotherm processes. An overview of these two processes are given in the table below.

Equipment performance and process related parameters

Parameter Value
Sample dimensions Diameter

50, 100 or 150 mm (~ 2", 4" or 6")

Sample thickness

Maximum 1,0 mm

Process parameters Temperature

52*C

pH

3,5 - 3,8

Sample requirements Seed metal

100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter-System(Lesker).

Allowed materials

Most materials allowed. See below.

Forbidden materials

Copper, cobalt. See machine manual on LabManager for details