Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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|style="background:LightGrey; color:black"|Seed metal | |style="background:LightGrey; color:black"|Seed metal | ||
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100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter | 100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System(Lesker)]]. | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||