Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
| Line 66: | Line 66: | ||
|style="background:LightGrey; color:black"|Seed metal | |style="background:LightGrey; color:black"|Seed metal | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
100 nm of either NiV, Ti+Au or Cr+Au recommended | 100 nm of either NiV, Ti+Au or Cr+Au recommended. Most commonly seed metals are sputtered using the Sputter system (Lesker). | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||