Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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At the anode metallic nickel is oxidized to nickel ions: | At the anode metallic nickel is oxidized to nickel ions: | ||
Ni (s) | Ni (s) ⇒ Ni<sup>2+</sup> (aq) + 2 e<sup>-</sup> | ||
At the cathode (the sample surface), nickel ions from solution are reduced to metallic nickel: | At the cathode (the sample surface), nickel ions from solution are reduced to metallic nickel: | ||
Ni<sup>2+</sup> (aq) + 2 e<sup>-</sup> | Ni<sup>2+</sup> (aq) + 2 e<sup>-</sup> ⇒ Ni (s) | ||
The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine. | The minimal charge accepted by the software on the machine is 0.1 Ah (Ampere-hours). This corresponds to roughly 2 µm of nickel on a four inch wafer. You can abort a program prematurely to achieve even lower thicknesses, but this requires manual control of the machine. | ||