Revision as of 15:20, 27 May 2013

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Technotrans microform.200

The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and the apply a voltage across the sample and the anode. The anode is a basket filled with nickel pellets. The cathode is the sample to be coated with nickel.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

LabManager

Process information

Description of standard processes

Equipment performance and process related parameters

Equipment		Equipment 1
Purpose		Purpose 1 Purpose 2
Performance	Response 1	Performance range 1 Performance range 2
Performance	Response 2	Performance range
Process parameter range	Parameter 1	Range
Process parameter range	Parameter 2	Range
Substrates	Batch size	# 50 mm wafer # 100 mm wafer # 150 mm wafer
	Allowed materials	Allowed material 1 Allowed material 2

@@ Line 4: / Line 4: @@
 <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
-== Name of equipment ==
+== Technotrans microform.200 ==
+The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and the apply a voltage across the sample and the anode. The anode is a basket filled with nickel pellets. The cathode is the sample to be coated with nickel.
-Write a short description of the equipment(s).
 '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''