Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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Example:
*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Electroplating of nickel|Standard processes]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Electroplating of nickel|Description of standard processes]]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==

Revision as of 15:15, 27 May 2013

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Name of equipment

Write a short description of the equipment(s).

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Electroplating-Ni positioned in cleanroom 1

LabManager

Process information

Example:

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Purpose 1
  • Purpose 2
Performance Response 1
  • Performance range 1
  • Performance range 2
Response 2
  • Performance range
Process parameter range Parameter 1
  • Range
Parameter 2
  • Range
Substrates Batch size
  • # 50 mm wafer
  • # 100 mm wafer
  • # 150 mm wafer
Allowed materials
  • Allowed material 1
  • Allowed material 2