Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The image is from the cleanroom at the place it was refurbish in California.]]
[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The image is from the cleanroom at the place it was refurbish in California.]]


Particle counting of an unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it will not count as particles.  
Particle counting of an unpatterned surface. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films like Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it will not count as particles.  




Revision as of 09:18, 28 May 2013

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particle counting of an unpatterned surface. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films like Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it will not count as particles.



Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Particles counting
Performance Particles size
  • 0.1 µm to 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 1 atm
Substrates Batch size
  • Small wafer pieces can all be used
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers
Substrate material allowed
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