Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Parameter 1
|style="background:LightGrey; color:black"|Parameter 1
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*Range
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*Range
*Range
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|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|Parameter 2
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*Range
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*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
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*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*Allowed material 1  
*Allowed material 2
*Allowed material 2
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*Allowed material 1
*Allowed material 2
*Allowed material 3
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Revision as of 12:56, 8 May 2013

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Name of equipment

Write a short description of the equipment(s).

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Electroplating-Ni positioned in cleanroom 1

LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Purpose 1
  • Purpose 2
Performance Response 1
  • Performance range 1
  • Performance range 2
Response 2
  • Performance range
Process parameter range Parameter 1
  • Range
Parameter 2
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2