Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b> | |style="background:WhiteSmoke; color:black"|<b>Equipment 1</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Purpose 1 | *Purpose 1 | ||
*Purpose 2 | *Purpose 2 | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
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*Performance range 1 | *Performance range 1 | ||
*Performance range 2 | *Performance range 2 | ||
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|style="background:LightGrey; color:black"|Response 2 | |style="background:LightGrey; color:black"|Response 2 | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Performance range | *Performance range | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range |
Revision as of 13:38, 7 May 2013
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Name of equipment
Write a short description of the equipment(s).
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
Equipment | Equipment 1 | ||
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Purpose |
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Performance | Response 1 |
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Response 2 |
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Process parameter range | Parameter 1 |
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Parameter 2 |
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Substrates | Batch size |
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Allowed materials |
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