Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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== Flip-chip bonder (glue attachment) == | == Flip-chip bonder (glue attachment) == | ||
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Flip-chip bonder (new picture coming soon)]] | |||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Flip-chip Bonder in LabManager (not there yet)] | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== |
Revision as of 15:58, 6 May 2013
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Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Flip-chip bonder (glue attachment)
Flip-chip Bonder in LabManager (not there yet)
Equipment | Die bonder | Flip-chip bonder | |
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Performance |
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Substrates | Allowed materials |
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