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Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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Jehan (talk | contribs)
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== Flip-chip bonder (glue attachment) ==
== Flip-chip bonder (glue attachment) ==
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|right|thumb|The Flip-chip bonder (new picture coming soon)]]
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Flip-chip Bonder in LabManager (not there yet)]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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