Specific Process Knowledge/Lithography: Difference between revisions
No edit summary |
No edit summary |
||
| Line 165: | Line 165: | ||
<br clear="all" /> | <br clear="all" /> | ||
==Equipment List== | |||
[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]] | |||
[[Specific Process Knowledge/Lithography/Coaters|Coaters]] | |||
[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]] | |||
[[Specific Process Knowledge/Lithography/Baking|Baking]] | |||
[[Specific Process Knowledge/Lithography/Developing|Developing]] | |||
[[Specific Process Knowledge/Lithography/StripLiftOff|Strip, Lift-off]] | |||
[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]] | |||
[[Specific Process Knowledge/Lithography/Characterization|Characterization]] | |||
[[Specific Process Knowledge/Lithography/LaserWriter|LaserWriter]] | |||
[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]] | |||
[[Specific Process Knowledge/Lithography/DUVStepper|DUV Stepper]] | |||
[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]] | |||
[[Specific Process Knowledge/Lithography/3D|3D]] | |||