Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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==Overview of the performance of the Surfscan 6420 and some process related parameters==
==Overview of the performance of the Surfscan 6420 and some process related parameters==

Revision as of 12:05, 3 May 2013

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.



Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Particles counting
Performance Particles size
  • 0.1 µm to 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Process pressure
  • 1 atm
Substrates Batch size
  • Small wafer pieces can all be used
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers
Substrate material allowed
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