Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
| Line 146: | Line 146: | ||
*DUV resist | *DUV resist | ||
*E-beam resist | *E-beam resist | ||
*Silicon | *(Poly)Silicon | ||
*Silicon Nitride | *Silicon Nitride | ||
*Metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
| Line 153: | Line 153: | ||
*DUV resist | *DUV resist | ||
*E-beam resist | *E-beam resist | ||
*Silicon | *(Poly)Silicon | ||
*Silicon Nitride | *Silicon Nitride | ||
*Aluminium | *Aluminium | ||