Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

@@ Line 24: / Line 24: @@
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+*Particles counting
+|-
+!style="background:silver; color:black" align="center" rowspan="3"|Performance
+|style="background:LightGrey; color:black"|Particles size
+|style="background:WhiteSmoke; color:black"|
+*0.1 µm to 3 µm
+|-
+|style="background:LightGrey; color:black"|Througput
+|style="background:WhiteSmoke; color:black"|
+*Up to 100 wafer per hour (200 mm)
 |-
-!style="background:silver; color:black" align="center"|Performance
+|style="background:LightGrey; color:black"|Repeatbility
-|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
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 | style="background:LightGrey; color:black"|Substrate material allowed
 |style="background:WhiteSmoke; color:black"|
-*Silicon wafers (new or RCA cleaned wafers)
-*From A2 furnace directly (e.g. incl. Predep HF)
 |-
 |}