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KLA-Tencor Surfscan 6420

Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

LabManager

Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
Performance
Process parameter range	Process Temperature	Room temperature
Process parameter range	Process pressure	1 atm
Substrates	Batch size	1-25 100 mm wafers 1-25 150 mm wafers
Substrates	Substrate material allowed	Silicon wafers (new or RCA cleaned wafers) From A2 furnace directly (e.g. incl. Predep HF)

@@ Line 22: / Line 22: @@
 !style="background:silver; color:black;" align="center"|Purpose
 |style="background:LightGrey; color:black"|
-*Drive-in of boron
-*Oxidation of silicon
+|style="background:WhiteSmoke; color:black"|
-*Oxidation of boron phase layer
-*Annealing of the oxide
-|style="background:WhiteSmoke; color:black"|Oxidation:
-*Dry
-*Wet: with torch (H<sub>2</sub>+O<sub>2</sub>)
 |-
 !style="background:silver; color:black" align="center"|Performance
-|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
+|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
-*Dry SiO<sub>2</sub>: 50 Å  to ~2000 Å (takes too long to make it thicker)
-*Wet SiO<sub>2</sub>: 50 Å to ~3 µm (takes too long to make it thicker)
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
 |style="background:LightGrey; color:black"|Process Temperature
 |style="background:WhiteSmoke; color:black"|
-*800-1150 <sup>o</sup>C
+*Room temperature
 |-
 |style="background:LightGrey; color:black"|Process pressure
 |style="background:WhiteSmoke; color:black"|
 *1 atm
-|-
-|style="background:LightGrey; color:black"|Gasses on the system
-|style="background:WhiteSmoke; color:black"|
-*O<sub>2</sub>, H<sub>2</sub> and N<sub>2</sub>
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates