Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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Disco Automatic dicing saw, model DAD321 | |||
The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually. | |||
The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom. | |||
The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range. | |||
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