Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
Appearance
| Line 173: | Line 173: | ||
![[Specific Process Knowledge/Etch/Wet Polysilicon Etch|Wet PolySilicon etch]] | ![[Specific Process Knowledge/Etch/Wet Polysilicon Etch|Wet PolySilicon etch]] | ||
![[Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)|RIE (Reactive Ion Etch)]] | ![[Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)|RIE (Reactive Ion Etch)]] | ||
![[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus ( | ![[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus (Deep Reactive Ion Etch)]] | ||
![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] | ||