Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
| Line 318: | Line 318: | ||
*Silicon Nitride | *Silicon Nitride | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
* | *Photo-, DUV- and e-beamresist | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
*Quartz/fused silica | *Quartz/fused silica | ||
| Line 327: | Line 326: | ||
*Silicon Nitride | *Silicon Nitride | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
* | *Photo-, DUV- and e-beamresist | ||
*Aluminium oxide | *Aluminium oxide | ||
*Quartz/fused silica | *Quartz/fused silica | ||
| Line 336: | Line 334: | ||
*Silicon Nitride | *Silicon Nitride | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
* | *Photo-, DUV- and e-beamresist | ||
*Aluminium | *Aluminium | ||
*Quartz/fused silica | *Quartz/fused silica | ||
| | | | ||
*Silicon | *Silicon | ||
* | *Photo-, DUV- and e-beamresist | ||
*PolySilicon | *PolySilicon | ||
*Silicon oxide | *Silicon oxide | ||