Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions
| Line 134: | Line 134: | ||
*Well suited for removing all PECVD nitride on a wafer surface (nitride strip) without a mask. Etches LPCVD nitride very slowly | *Well suited for removing all PECVD nitride on a wafer surface (nitride strip) without a mask. Etches LPCVD nitride very slowly | ||
| | | | ||
* | *Anisotropic etch: vertical sidewalls | ||
| | | | ||
*State-of-the-art dry silicon etcher with atmospheric cassette loader | *State-of-the-art dry silicon etcher with atmospheric cassette loader | ||