Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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*E-beam resist | *E-beam resist | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
| | | | ||
* | *Silicon | ||
* | *Silicon Oxide | ||
* | *Silicon Nitride | ||
*Silicon Oxynitride | |||
*Photoresist | |||
*zep resist | |||
*Aluminium oxide | |||
| | | | ||
* | *Silicon | ||
* | *Silicon Oxide | ||
* | *Silicon Nitride | ||
*Silicon Oxynitride | |||
*Photoresist | |||
*E-beam resist | |||
*Aluminium | |||
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* | |||
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* | |||
|- | |- | ||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||