Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions
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|The plasma asher is good for dry stripping polymers. It can also be used for descum and pattering of polymers. This plasma asher is for Si wafers without metals. | |The plasma asher is good for dry stripping polymers. It can also be used for descum and pattering of polymers. This plasma asher is for Si wafers without metals. | ||
|RIE2 can etch polymers in almost the same way as the ASE. We prefer the you use the ASE but there can be situations where the sample will not be allowed in the ASE (e.g. if there are metal on). If you think you need to use the RIE2 for polymer etching you need to get a special permission from the plasma group, see contact info on the RIE2 page in LabManager. | |RIE2 can etch polymers in almost the same way as the ASE. We prefer the you use the ASE but there can be situations where the sample will not be allowed in the ASE (e.g. if there are metal on). If you think you need to use the RIE2 for polymer etching you need to get a special permission from the plasma group, see contact info on the RIE2 page in LabManager. | ||
|Wet polymer | |Wet polymer etching is used for stripping a resist/polymer when it is no longer needed. E.g. removing resist masks. | ||
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*<nowiki>#</nowiki>25 150 mm wafers | *<nowiki>#</nowiki>25 150 mm wafers | ||
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* | *Samples smaller that can fit on a 100mm wafer. | ||
*<nowiki>#</nowiki>1 50 mm wafer | *<nowiki>#</nowiki>1 50 mm wafer | ||
*<nowiki>#</nowiki>1 100 mm wafer | *<nowiki>#</nowiki>1 100 mm wafer | ||