Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions
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*Oxygen plasma | *Oxygen plasma | ||
*Oxygen plasma mixed with | *Oxygen plasma mixed with N<sub>2</sub> | ||
**CF<sub>4</sub> | **CF<sub>4</sub> | ||
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*Oxygen plasma | *Oxygen plasma | ||
*Oxygen plasma mixed with N<sub>2</sub> | |||
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*Oxygen plasma | *Oxygen plasma | ||
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**Acetone | **Acetone | ||
**1165 Remover | **1165 Remover | ||
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*<nowiki>#</nowiki>25 50 mm wafers | *<nowiki>#</nowiki>25 50 mm wafers | ||
*<nowiki>#</nowiki>25 100 mm wafers | *<nowiki>#</nowiki>25 100 mm wafers | ||
*<nowiki>#</nowiki> | *<nowiki>#</nowiki>25 150 mm wafer | ||
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*<nowiki>#</nowiki> small samples | *<nowiki>#</nowiki> small samples | ||