Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride: Difference between revisions
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*1-25 4" wafer per run | *1-25 4" wafer per run | ||
* | *Deposition on both sides of the substrate | ||
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|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed | |style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed | ||