Specific Process Knowledge/Etch/Etching of Polymer/Polymer Etch by ASE

Etching of polymers on the ASE

SPTS has provided some recipes for polymer etching on the ASE. They have NOT been tested yet (As of August 2011) and we are therefore very interested in learning whatever experiences you have. Please contact Jonas. The recipes are located in the root folder. Please copy them to your own folder and modify them there for your own purposes as you would with any other recipe.

The polymer recipes

Name	Materials		Process parameters								Comments by Kevin Riddell SPTS prior to any tests at Danchip
	Mask	Etched	O2	CO2	SF6	He/Ar	Pressure	Temp	Coil	Platen
poly1	Oxide hard mask	polyimide/PMMA	0	50	0	0	4	0	600	150	This will etch PMGI, PI, & standard resists. We've never tried it for PMMA, but it should work
poly2		standard resists, PI PMMA	20	0	0	20	3	10	600	150	This will give higher etch rates & better selectivities, but slightly more bowed profiles
poly3		BCB	43	0	7	0	4	20	800	150	A good start point for PDMS / Ormocer-type Si/ inorganic-containing polymers. The SF6/O2 ratio will depend on the composition of the polymer.

CYTOP etching: Results by Fei Wang, DTU Nanotech

Recipe

Folder\name	Materials		Process parameters								Comments
	Mask	Etched	O2	CO2	SF6	He/Ar	Pressure	Temp	Coil	Platen
set\microrea\feicy3	1.5 µm PR	CYTOP	5	0	0	20	3	0	600	150	Estimated etch rate ~1.3um/min, selectivity around 1:8, etch load app. 10%

• The results of the CYTOP etching
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