Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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===Overview of the data for the chromium etches=== | ===Overview of the data for the chromium etches=== | ||
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! Chromium etch 1 | ! Chromium etch 1 | ||
! Chromium etch 2 | ! Chromium etch 2 | ||
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|-style="background:WhiteSmoke; color:black" | |||
!General description | |||
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Etch of chromium | Etch of chromium | ||
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Etch of chromium | Etch of chromium | ||
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!Link to safety APV and KBA | |||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]. | |[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]. | ||
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | [http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | ||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | |[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | ||
|- | |- | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Chemical solution | |||
|Chrome Etch 18 | |Chrome Etch 18 | ||
|HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate - 90ml:1200ml:15g | |HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate - 90ml:1200ml:15g | ||
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|-style="background:LightGrey; color:black" | |||
!Process temperature | |||
|Room temperature | |Room temperature | ||
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!Possible masking materials | |||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|- | |- | ||
| | |||
|-style="background:LightGrey; color:black" | |||
!Etch rate | |||
|~ ? nm/min | |~ ? nm/min | ||
|~40-100 nm/min | |~40-100 nm/min | ||
|- | |- | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Batch size | |||
|1-7 wafers at a time | |1-7 wafers at a time | ||
|1-7 wafers at a time | |1-7 wafers at a time | ||
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|-style="background:LightGrey; color:black" | |||
!Size of substrate | |||
|4" wafers | |4" wafers | ||
|4" wafers | |4" wafers | ||
|- | |- | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
|No restrictions. | |No restrictions. | ||
Make a note on the beaker of which materials have been processed. | Make a note on the beaker of which materials have been processed. |
Revision as of 14:21, 30 May 2013
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Wet etching of Chromium
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. You can see the APV here. We have two solutions for this:
- Commercial chromium etch (Chrome Etch 18). You can see the KBA here
- HNO3:H2O:cerisulphate - 90ml:1200ml:15g
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 2:
- Take a beaker and add 15g of cerisulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO3
- When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.
Overview of the data for the chromium etches
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Link to safety APV and KBA | see APV here. | see APV here |
Chemical solution | Chrome Etch 18 | HNO3:H2O:cerisulphate - 90ml:1200ml:15g |
Process temperature | Room temperature | Room Temperature |
Possible masking materials | Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) |
Etch rate | ~ ? nm/min | ~40-100 nm/min |
Batch size | 1-7 wafers at a time | 1-7 wafers at a time |
Size of substrate | 4" wafers | 4" wafers |
Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |
No restrictions.
Make a note on the beaker of which materials have been processed. |