Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions
Created page with "Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionf..." |
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===Comparing the two solutions=== | ===Comparing the two solutions=== | ||
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|-style="background:silver; color:black" | |||
! | ! | ||
! Iodine based gold etch | ! Iodine based gold etch | ||
! Aqua Regia (Kongevand) | ! Aqua Regia (Kongevand) | ||
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!General description | |||
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Etch of pure Gold with or without photoresist mask. | Etch of pure Gold with or without photoresist mask. | ||
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Etch of pure Gold (as stripper). | Etch of pure Gold (as stripper). | ||
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|-style="background:LightGrey; color:black" | |||
!Chemical solution | |||
|KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml) | |KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml) | ||
|HCl:HNO<sub>3</sub> (3:1) | |HCl:HNO<sub>3</sub> (3:1) | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Process temperature | |||
|20 <sup>o</sup>C | |20 <sup>o</sup>C | ||
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|-style="background:LightGrey; color:black" | |||
!Possible masking materials | |||
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Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||
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Unmasked - used as a stripper | Unmasked - used as a stripper | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Etch rate | |||
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~100 nm/min | ~100 nm/min | ||
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~(??) nm/min - fast etch | ~(??) nm/min - fast etch | ||
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|-style="background:LightGrey; color:black" | |||
!Batch size | |||
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1-5 4" wafers at a time | 1-5 4" wafers at a time | ||
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1-5 4" wafer at a time | 1-5 4" wafer at a time | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Size of substrate | |||
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2-6" wafers | 2-6" wafers | ||