Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions

@@ Line 114: / Line 114: @@
 *Metals
 |-
+|}
+==UNDER CONSTRUCTION: Quality control (QC) for Wordentec==
+{| border="1" cellspacing="2" cellpadding="2" colspan="3"
+|bgcolor="#98FB98" |'''Quality control (QC) for Wordentec'''
+|-
+|
+*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1401&mach=20 QC procedure for Alcatel]<br>
+*[http://labmanager.danchip.dtu.dk/view_binary.php?fileId=2064 The newest QC data for Alcatel]<br>
+{| {{table}}
+| align="center" |
+{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
+! QC Recipe:
+! Au
+|-
+|Deposition rate
+|10 Å/s
+|-
+|Thickness
+|1000 Å
+|-
+|Pressure
+|Below 2*10<sup>-6</sup>
+|-
+|}
+| align="center" valign="top"|
+{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:480px"
+!QC limits
+!Alcatel
+|-
+|Measured average thickness (Å)
+|900-1100 Å
+|-
+|Lowest accepted deposition rate (Å/s)
+|6 Å/s
+|-
+|}
+|-
+|}
+Thickness is measured in 5 points with one of the Dektak instruments.
 |}