Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions
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Here are some of the standard processes used in the BCB Curing Oven. | Here are some of the standard processes used in the BCB Curing Oven. | ||
=BCB curing:= | === BCB curing:=== | ||
* Long curing at 210°C: BCB210AL.PDF/[[file:BCB210BL.PDF|BCB210BL.PDF]] | |||
* Long curing at 250°C: BCB250AL.PDF/[[file:BCB250BL.PDF|BCB250BL.PDF]] | |||
The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes. | The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes. | ||
===General processes=== | |||
=General processes= | |||
There are a number of general processes named DxxxCyyy.PDF. | There are a number of general processes named DxxxCyyy.PDF. | ||
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The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature. | The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature. | ||
The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to | The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to room temperature as fast as possible. | ||
The program sequence looks like this for the file D200C060.PDF: | The program sequence looks like this for the file D200C060.PDF: | ||
<pre>; | |||
< | |||
; | |||
; stored 31.08.2011 at 18:15:47 | ; stored 31.08.2011 at 18:15:47 | ||
{P0} | {P0} | ||
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02,05:00,0002,- C 1 - - - - - - | 02,05:00,0002,- C 1 - - - - - - | ||
03,00:00,0000,- C - - - - - - - | 03,00:00,0000,- C - - - - - - - | ||
</ | </pre> | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||