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Specific Process Knowledge/Etch/Wet Titanium Etch: Difference between revisions

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===Comparing the two solutions===
===Comparing the two solutions===
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
|-


{| border="1" cellspacing="0" cellpadding="4"  
|-
!  
|-style="background:silver; color:black"
!
! width="200" | BHF
! width="200" | BHF
! width="200" | Cold RCA1  
! width="200" | Cold RCA1  
|-  
|-  
|-style="background:WhiteSmoke; color:black"
|'''General description'''
|'''General description'''
| Etch of titanium with or without photoresist mask.
| Etch of titanium with or without photoresist mask.
| Etch of titanium (as stripper or with eagle resist).
| Etch of titanium (as stripper or with eagle resist).
|-
|-
|-style="background:LightGrey; color:black"
|'''Link to safety APV and KBA'''
|'''Link to safety APV and KBA'''
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]
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|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]  
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]  
|-
|-
|-style="background:WhiteSmoke; color:black"
|'''Chemical solution'''
|'''Chemical solution'''
|HF:NH<sub>4</sub>F   
|HF:NH<sub>4</sub>F   
|NH<sub>3</sub>OH:H<sub>2</sub>O<sub>2</sub>:H<sub>2</sub>O - 1:1:5
|NH<sub>3</sub>OH:H<sub>2</sub>O<sub>2</sub>:H<sub>2</sub>O - 1:1:5
|-
|-
|'''Process temperature'''
 
 
|-style="background:LightGrey; color:black"
!Process temperature
|Room temperature
|Room temperature
|Room temperature
|Room temperature
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|-
|-


|'''Possible masking materials'''
|-style="background:WhiteSmoke; color:black"
!Possible masking materials
|
|
Photoresist (1.5 µm AZ5214E)
Photoresist (1.5 µm AZ5214E)
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Eagle resist
Eagle resist
|-
|-
|'''Etch rate'''
 
|-style="background:LightGrey; color:black"
!Etch rate
|
|
Not known (it bubbles while etching)
Not known (it bubbles while etching)
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Not known
Not known
|-
|-
|'''Batch size'''
 
|-style="background:WhiteSmoke; color:black"
!Batch size
|
|
1-5 4" in beaker
1-5 4" in beaker
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1-5 4" wafer at a time
1-5 4" wafer at a time
|-
|-
|'''Etch bath'''
 
|-style="background:LightGrey; color:black"
!Etch bath
|Beaker or PP-etch bath in the fume hood in cleanroom 2.
|Beaker or PP-etch bath in the fume hood in cleanroom 2.
|Beaker
|Beaker
|-
|-
|'''Allowed materials'''
 
|-style="background:WhiteSmoke; color:black"
!Allowed materials
|
|
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
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