Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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| '''Link to APV/KBA''' | | '''Link to APV/KBA''' | ||
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[http://labmanager.danchip.dtu.dk/d4Show.php?id= | [http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | ||
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[http://labmanager.danchip.dtu.dk/d4Show.php?id= | [http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | ||
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| '''Chemical solution''' | | '''Chemical solution''' |
Revision as of 11:23, 21 March 2013
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Wet etching of Chromium
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- HNO3:H2O:cerisulphate - 90ml:1200ml:15g - standard at Danchip
- Commercial chromium etch
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 1:
- Take a beaker and add 15g of cerisulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO3
- When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.
Overview of the data for the chromium etches
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Link to APV/KBA | ||
Chemical solution | HNO3:H2O:cerisulphate - 90ml:1200ml:15g | . |
Process temperature | Room temperature | . |
Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
. |
Etch rate |
~40-100 nm/min |
. |
Batch size |
1-25 wafers at a time |
. |
Size of substrate |
4" wafers |
. |
Allowed materials |
No restrictions. Make a note on the bottle of which materials have been processed. |
. |