Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions
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{| border="1" cellspacing=" | {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | ||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
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*smaller pieces | *smaller pieces | ||
|- | |- | ||
|-style="background:silver; color:black" | |||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |||
| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|- | |- | ||
|-style="background:silver; color:black" | |||
| Deposition rate | | Deposition rate | ||
|2Å/s to | |2Å/s to 10Å/s | ||
|- | |- | ||
|} | |} | ||