Specific Process Knowledge/Etch/Wet Titanium Etch: Difference between revisions

Revision as of 15:51, 12 March 2013 view source BGE (talk \| contribs) Bureaucrats, danchip, Administrators 2,908 edits Created page with "Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Meta..."		Revision as of 11:16, 21 March 2013 view source Kb (talk \| contribs) danchip 103 edits No edit summary Newer edit →
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			'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Titanium_Etch click here]'''

	Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher\|ICP]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.		Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher\|ICP]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300\|IBE]] by sputtering with Ar ions.