Specific Process Knowledge/Etch/Etching of Chromium

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Etching of Chromium

Etching of chromium can be done either by wet etch, dry etch or by sputtering with ions.

• Etching of Cr by wet etch
• Etching of Cr by dry etch
• Sputtering of Cr

Comparison of Aluminium Etch Metodes

	Cr wet etch 1	Cr wet etch 2	ICP metal	IBE (Ionfab300+)
Generel description	Wet etch of Cr that you need to mix your self	Wet etch of Cr premixed	Dry plasma etch of Cr	Sputtering of Cr - pure physical etch
Etch rate range	~40-100nm/min	~?nm/min	~14 nm/min (depending on features size and etch load)	~30nm/min (not tested yet)
Etch profile	Isotropic	Isotropic	Anisotropic (vertical sidewalls)	Anisotropic (angles sidewalls, typical around 70 dg)
Substrate size	Any size and number that can go inside the beaker in use	Any size and number that can go inside the beaker in use	smaller pieces on a carrier wafer #1 100mm wafers (when set up to 100mm wafers) #1 150mm wafers (when set up to 150mm wafers)	Smaller pieces glued to carrier wafer #1 50mm wafer #1 100mm wafer #1 150mm wafer #1 200mm wafer
Allowed materials	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist	Aluminium Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Photoresist E-beam resist	Silicon Quartz/fused silica Photoresist/e-beam resist PolySilicon, Silicon oxide Silicon (oxy)nitride Aluminium Titanium Chromium	Silicon Silicon oxides Silicon nitrides Metals from the +list Metals from the -list Alloys from the above list Stainless steel Glass III-V materials Resists Polymers Capton tape