Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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== Nickel deposition == | == Nickel deposition == | ||
Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | ||
*[[/Electroplating of nickel|Electroplating of nickel]] | |||
Revision as of 13:42, 7 May 2013
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Nickel deposition
Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1 µm | 10Å to 1000 Å |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s |
| Comment | Only very thin layers (up to 100nm). |