Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]]. | |Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]]. | ||
|Depending on process | |Depending on process paramters (see logbook) | ||
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Revision as of 09:39, 24 April 2013
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Deposition of Silver
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec)
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|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to about 5000Å | 10Å to about 3000Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | Dependent on process parameters. | Depending on process paramters (see logbook) |
| Comment | Only very thin layers. | Only very thin layers (up to 100nm). |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec