Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

@@ Line 11: / Line 11: @@
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
 |-
 | Batch size
@@ Line 20: / Line 21: @@
 *6x4" wafers or
 *6x6" wafers
+|
+*1x4" wafer or
+*1x6" wafer
+*smaller pieces
 |-
 | Pre-clean
+|RF Ar clean
 |RF Ar clean
 |RF Ar clean
@@ Line 27: / Line 33: @@
 | Layer thickness
 |10Å to 5000Å
+|10Å to 5000Å
 |10Å to 5000Å
 |-
@@ Line 32: / Line 39: @@
 |2Å/s to 15Å/s
 |10Å/s to 15Å/s
+|? Å/s to ? Å/s
 |-
 |}